Product Technic Parameter(Double-sided):

Copper Thickness: 0.25~3.0OZ
Base Board Thickness: 0.3~3.2mm
Incombustibility: 94V-0
Peelable resistance: 12.3N/cm
Twist: is less than or equal to 0.5%
Insulation resistance: is more than or equal to the 11st times of ten OM
Test voltage: 10-300V
Finished board area: 560x970mm
Min. Line Width and Spacing: 0.1/0.1mm
Copper thickness in hole: is more than or equal to 25.0um
Mini. pad diameter: Out layer-----0.076mm
Mini. Hole Diameter: 0.25mm
Hole tolerance: PTH---plus or minus 0.076mm NPTH---plus or minus 0.05mm
Hole location tolerance: plus or minus 0.076mm
profile tolerance: Routing-----plus or minus 0.1mm Punching-----plus or minus 0.13mm
Solder mask bridge ability: plus or minus 0.1mm
Solder mask rigidity: 6H
Solderable test: 245C 5 second
Thermal cycling ability: 288C 10 second
Surface Finishing: OSP, HAL, Immersion gold , Gold plating, Rosin, Gold finger
Qaulity standard: IPC-A-600F IPC-ML-950
Sample standard: STD-105E-II

Product Technic Parameter(Multilayer 4-12layers):

Copper Thickness: 0.5~3.0OZ
Base Board Thickness: 0.6~3.2mm
Incombustibility: 94V-0
Peelable resistance: 12.3N/cm
Twist: is less than or equal to 0.5%
Insulation resistance: is more than or equal to the 11st times of ten OM
Test voltage: 10-300V
Finished board area: 560x970mm
Min. Line Width and Spacing: 0.1/0.1mm
Copper thickness in hole: is more than or equal to 25.0um
Mini. pad diameter: Inner layer -----0.05mm Out-----layer 0.076mm
Mini. Hole Diameter: 0.2mm
Hole tolerance: PTH-----plus or minus 0.076mm NPTH-----plus or minus 0.05mm
Hole location tolerance: plus or minus 0.05mm
profile tolerance: Routing-----plus or minus 0.1mm Punching-----plus or minus 0.13mm
Solder mask bridge ability: plus or minus 0.075mm
Solder mask rigidity: 6H
Solderable test: 245C 5 second
Thermal cycling ability: 288C 10 second
Surface Finishing: OSP, HAL, Immersion gold , Gold plating, Rosin, Gold finger
Qaulity standard: IPC-A-600F IPC-ML-950
Sample standard: STD-105E-II