Join Us |Sign In | User Guide | Inquiry Cart (1) Join Us |Sign In | User Guide | Inquiry Cart (1)dalian jafeng electronics co., ltd
die attach, electronics, semiconductor, die bonder, transistor packaging, Manufacturer and Supplier - China(CN)
Epoxy die bonder-for ICs and LED package (HS-DC02)
* for SOT ĦBTSOP ĦBPLCC ĦBQFP ĦBQFN/MLF ĦBBGA package;
*Linear Moving System
*Digital bondhead
*Vision System
*Main Work Table
high quality & favorable price & outstanding technical support
UPH: >9000
Wafer: Max 8 inches (200mm)
Wafer Table: 237.5*237.5mm
Bonding Accuracy: ĦÓ50£gm, ĦÓ 3 degree
Chip Size: 0.2mm*0.2mm-2mm*2mm
Application: Leadframes, PCB
Dimension of Leadframe:
L: 6.0"-11.4" (150-290mm)
W: 0.6"-3.15" (15-80mm)
H: 4-30mil (0.1-0.75mm)Demision:
Unpack: 1810*1035*1446mm
Packed: 1910*1280*1710mm
Bonding Power: 30-2000g
Compressed Air: 0.5MPa ĦÓ
Voltage: 220VAC
Power: 1800 W
