�P Maximum flexibility for configuration of splitter / combiner functions
�P Low insertion loss
�P Dual operating wavelength windows (1310nm and 1550nm)
�P High port-to-port uniformity
�P SC/APC connectors ensure performance repeatability, compatibility and easy installation and maintenance
�P Removable connectors for easy cleaning
�P High packaging density (up to 16 modules per chassis)

LFOP OP38S8S unique scalable 8x8 splitter / combiner module provides optimum versatility in minimum rack space to meet a variety of network configuration requirements for optical splitting and combining functions. When fully loaded, CH3000 chassis holds 16 half-depth modules; its packaging concept also permits mounting in any standard LGX chassis