1.DP-50 / 75 semiconductor side-pump laser marking is widely used for marking many materials such as metal, alloy, oxide, ABS, epoxy resin, painting ink and IC ceramic etc.
2.The medium produces a lot of reverse particles to discharge laser, the strong pulse under the function of Q-switch so the efficiency of the electron-light transformation is high.
3.It can used for many kind of metal and non-metal materials, especially for the high strength, high brittle fracture and high-melting point materials.
4.In the laser processing there is no cutting-tool wear, and no cutting resistance inner object.
5.The laser bean is very fine, even can be micron-size, so it can be working on the products which have high precision requirement.
6.During the laser process, the laser bean have high precision and fast speed, for it is just part operation, there is no or just little influence on the other part, so the object has very small temperature distortion

Model DP-50 DP-75
Max.. laser average power 50 W 75 W
Pump source Semiconductor module
Standard marking area 75 ��75mm; 110 ��110mm; 175 ��175mm; 200 �� 200mm
Repeat frequency ? 30KHz
Cooling mode Invariable temperature protection
Beam quality < 6m2
Marking depth < 0.3mm
Linear speed ? 7000mm/s
Min. line width 0.015 mm
Min. character size 0.2 mm
Repetition accuracy �� 0.02mm
Power consumed < 1.5KW
Electrical source 220V ��5% AC, 50Hz, 30A
Software language Chinese; English
File format support dwg, dxf, bmp, jpg, png, tif, pcs, tag, gif, plt, ect
Operation temperature 13�XC ~ 28�XC.
Operation humidity 5% ~ 75%