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China Abrasives I&E Corp.

abrasives, ceramics, refractory, polycrystalline diamond, grinding, Manufacturer and Supplier - China

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Disclaimer

This company is a Free member of AsianProducts.
If you end up wanting to buy anything from this supplier, we strongly suggest you to use our Escrow service EZ Order. This will ensure a 100% safe transaction.

Information for Buyer

  • China Abrasives I&E Corp.
  • OEM Service: No
  • Register Time: 2010-03-11

  • (zhengzhou, China) Map
  • Phone: +86 /371-67668728
  • Contact Person: BROOKLYN LI

Products Detail

green silicon carbide(GC),Carborundum (caec-gc)

  • Business Information:
  • Supply Capability : 2000 TONS/ year
  • Certification : SGS,SGS
  • Mini Order : 50KGS
  • Packaging : standard export packing
  • FOB Port : xingang
  • Delivery Time : ASAP
  • Made In : China(CN)

Product Feature:

Green Silicon Carbide(GC),Carborundum

We manufactures Green Silicon Carbide to the finest powder, in custom sizes, to meet all our customers' needs. It is manufactured by a team of professionals dedicated to providing our customers the best in quality, service and support.

We has special abrasive powder for wire-sawing semiconductor material, which is different from traditional SiC abrasive powder, manufactured through many strict working procedures, and under 12 quality control targets. The products have the characteristics of high purity, high hardness, narrow distribution, good grain shape, no coarse grains and can reach high quality requirement. It is used for wire sawing 3-8 inch polycrystalline silicon, solar cell mono-crystalline silicon, gallium arsenide, quartz crystal and etc. The powder is the engineering material for semiconductor and solar cell industries. It can improve cutting efficiency, reduce production cost, and guarantee the quality of the wafers.
Applications:

Used for the wire saw of 3-12 inch mono-crystalline silicon, polycrystalline silicon, potassium arsenide, quartz crystal. It is the abrasive material for solar industry, semiconductor industry, and piezoelectric industry.

Features:
1. High purity and large crystal silicon carbide ingots ensure the excellent cutting capability and stable physical condition;
2. Grains are rounder with lots of sharper corner, which means mini TTV;
3. Particle size distribution is narrow and even;
4. High heat resisting and soft temperature under duty guarantee the small wire expansion in processing, suitable to all kinds of wire saw machining;
5. Grain surface processed specially, easily fit carrier liquid, such as glycol.

Product Specifications:

as per clients's requirements

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