 | Product Feature | | Major products: Printed Circuit Boards (PCB)
1>PCB layers: from 2layers to 24 layers.
2>PCB type: Double-sides, Multi-layers, Flexible, and Aluminum type.
3>Surface: Gold plating\HAL\OSP\Gold finger\Immersion Gold \Immersion Tin.
4>Base material thickness: 0.2-3.5mm
5>Base material copper thickness: 18um, 35um, 70um
4>Max. Board size: 600mm*700mm;
5>Min. board size: 5mm*5mm;
6>Min. line: 3mil/3mil;
7>Min. hole: 0.1mm/4mil(laser hole), 0.25mm/0.3mm;
8>Min. thickness: 0.2mm+/-0.08mm
9>Min. line width: HAL PCB: 0.10mm+20% (4mil+20%); Gold PCB: 0.075mm+20% (3mil+20%)
8>High density interconnecting: Blind/Buried via;
9>Copper to Edge-board: 0.5mm;
10>Hole side to Edge-board: 0.3mm
To know more about our corporation, kindly visit our website: www.sunshingintl.com |
 | Product Specifications | | Major products: Printed Circuit Boards (PCB)
1>PCB layers: from 2layers to 24 layers.
2>PCB type: Double-sides, Multi-layers, Flexible, and Aluminum type.
3>Surface: Gold plating\HAL\OSP\Gold finger\Immersion Gold \Immersion Tin.
4>Base material thickness: 0.2-3.5mm
5>Base material copper thickness: 18um, 35um, 70um
4>Max. Board size: 600mm*700mm;
5>Min. board size: 5mm*5mm;
6>Min. line: 3mil/3mil;
7>Min. hole: 0.1mm/4mil(laser hole), 0.25mm/0.3mm;
8>Min. thickness: 0.2mm+/-0.08mm
9>Min. line width: HAL PCB: 0.10mm+20% (4mil+20%); Gold PCB: 0.075mm+20% (3mil+20%)
8>High density interconnecting: Blind/Buried via;
9>Copper to Edge-board: 0.5mm;
10>Hole side to Edge-board: 0.3mm
To know more about our corporation, kindly visit our website: www.sunshingintl.com
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 | Business Condition | | | Mini Order: | 1 | | Packing: | ESD, Vacuum | | FOB Port: | Hong Kong | | Delivery Time: | 3 |
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 | Contact Information |  | | Contact Person: |  | | Phone: |  | | Fax: |  | | Business Address: | 5A02, Block B, HuangDu Plaza, ,ShenZhen,China(CN) | | E-Mail: |  |
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