SOLNET METAL INDUSTRY Co., Ltd. Rev: 2008/05/16 Ver.1HF-e solder wireAlloy Composition Sn99.25/Cu0.75 Details: Spool a b c d 1kg 65±2 67±2 20±1 3±1 0.5kg 63±2 71± 2 42±1 2±1 Unit:mm Item Specifications Flux content(%) 1.7±0.2Specific gravity 7.3 Liquidus temperature 227±6 Solidus temperature 227±6 Package weight Diameter<0.8mm,0.5kg ; Diameter>0.8mm,1.0kg Package unit 10 spools/boxUsageSuitable for use with standard wave soldering/solder postsRegulationJIS Z 3282 Storage information and warrantee period Store in a cool, dry, non-corrosive environment. Product warrantee period of 3 hemical composition of solder alloyMetal element Sn Cu Composition(%) Blance 0.75Maximum threshold of impurities in solder alloy Metal element Bi Zn Fe Al As SbCd Pb AgComposition(%) 0.1 0.002 0.02 0.002 0.03 0.120.002 0.05 ----Notes: This product and all components are compliant with RoHs and SS00259 regulation

Flux Name HF-e EV-B JIS Standard RBCharacteristics No HalogenLead Free SolderingChloride Content N.D.0.70-0.80%Copper Plate Corrosion no corrosion occurredno corrosion occurredWater Extraction Resistivity more than 450Ωmmore than 450ΩmExpansion more than 75%more than 80%Lead-Free SolderHigh-Purity Solder BarLow-Temperature Solder Product Name M20 M30 M705 M708 Sn97.5/Ag2.5 Sn99.3/Cu0.7 Composition Sn99.25Cu0.75Sn96.5Ag3.5Sn96.5Ag3Cu0.5Sn97Ag3Sn97.5Ag2.5Sn99.3Cu0.7Melting Point 227ºC221ºC219ºC221ºC 220ºC220ºC229ºC 227ºCCondensation Point217ºCSpecific Gravity 7.37.47.47.47.47.3