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die attach, electronics, semiconductor, die bonder, transistor packaging, Manufacturer and Supplier - China(CN)
Soft Solder Die Bonder-for Transistor Package (SS-DT01)
*for the packaging of TO-126, TO-220, TO-92
*Linear Moving System
*Digital Bondhead
*Vision System
*Main Wafer Table of Eight Temperature Zones
*Wire Dispenser and Prepress Force
*Buffered Handler
high quality & favorable price& outstanding technical support
Chip Size: 0.5mm*0.5mm-5mm*5mm
Leak detection of chips & re-pick
Bonding Accuracy: (-80gm, +80gm); (-2 degree, +2 degree) ;
Bonding Speed: UPH>4800
Wafer Size: max 8 inches
Dimensions: 1810(W)*1035(D)*1446(H)
Weight: 1200KG
Air Pressure: 0.5 MPa
Voltage: 220VAC
Power: 1800W
