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Rigid-Flex Circuit Board  (IPC-600F) | | |
 Product Feature | Two- to Four-Layer Rigid-Flex PCBs with FR4/HDI-PDA Laminate Material
Key Specifications/Special Features:
Number of layers: 2 to 4
Thickness: 12 mil only
Thermal performance: 30% better conduction than standard 0.062-inch FR4
New FR4 technology from photo circuit
New thermally conductive adhesive technology
Suitable for body through power train controller application
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