Multi-Layer Flexible Printed Circuit Board Max Layer: 6 conductive layers (polyimide) 2 conductive layers (polyester) Max Size: up to 600. 0mm x 600. 0mm Base Copper: 1/2 oz. - 0.018mm thick copper 1 oz. - 0.036mm thick copper 2 oz. - 0.0... - Update: 2006-02-01

Circuit Sizes: Single Sided Up to 22" x 28" - (558.8mm x 711.2mm) Double Sided Up to 16" x 22" - (406.4mm x 588.8mm) Maxi-Flex Up to 10" x 16 feet - (254mm x 4877.0mm) Hole Size: Non-Plated Thru Holes. 010" (. 25mm) min. Drilled hole size... - Update: 2006-02-01

Printed Circuit Board Assembly Service Key Specifications/Special Features: Applications: Computer motherboard, net card communication card SMD, DIP, AI, OEM/ODM assembly Complete product assembly including structural parts, microchip progr... - Update: 2006-02-01

Featured Specification: Electrical characteristics: Contact rating: Contact circuit rating: 30VDC, 33mA; 10VDC, 100mA Open circuit resistance: DC250V 100Mohm min Reverse voltage: 205V/minute Circuit resistance: 150ohm max. Switch stroke: ... - Update: 2006-02-01

Membrane Switch Specification Operation voltage: < 35 VDC Operation current: - Update: 2006-02-01

Membrane Keypad & Keyboard Specification Size: 5 x 5mm (minimum), 800 x 460mm (maximum) Thickness: 0.15mm to 03mm Color: Blue, green, blue-green, white, and other colors Storage temperature: -40 to +80 degrees Celsius Operating temperature... - Update: 2006-02-01

Metal Dome/Poly Dome Applications: Electronics controller Electrical Characteristics: Rating voltage: 24VDC Rating current: 10mA Contact resistance: 10 ohms maximum - Update: 2006-02-01

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Two- to Four-Layer Rigid-Flex PCBs with FR4/HDI-PDA Laminate Material Key Specifications/Special Features: Number of layers: 2 to 4 Thickness: 12 mil only Thermal performance: 30% better conduction than standard 0.062-inch FR4 New FR4 te... - Update: 2006-02-01