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Dalian jafeng semiconductor device co., ltd

die bonder, semiconductor assembly, die attach, electronics pacakge, electronics package, Manufacturer and Supplier - China(CN)

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  • Dalian jafeng semiconductor device co., ltd
  • Target Markets: worldwide
  • Business Type: Manufacturer
  • OEM Service: Yes
  • Register Time: 2006-07-17

  • (dalian, China(CN)) Map
  • Local time: 12:24:25 2009-12-18
  • Phone: +86/411-84755101
  • Contact Person: sheila

We are one professional manufacture of die bonders used for Transistor, ICs and LED package with high speed & high accuracy & competitive price. Our products mainly are: Epoxy Die Bonder: 1) HS-DC01: used in IC packaging, DIP, SOP, PLCC, SSOP, TSOP, QFP, BGA etc; 2) HS-DC02: used... More information

Dalian jafeng semiconductor device co., ltd
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Business Address:dalian,dalian,China(CN)
Web Site:http://www.visionjafeng.com
E-Mail:Contact Now
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