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POE Precision Electronics co.,ltd  
News Item  
Last Updated: 2008/06/05
  HDI 8 layer mobile PCB
 
 
8 layers HDI
Material:FR-4+RCC
Thickness: 0.8mm
Surface processing:immersion gold
Laser drill hole(Min.):0.1mm
Buried and blind via structure:L1-L2,,L2-L7,L8-L7
Min. line space: 0.1mm
Min. line width: 0.1mm
 
 
 
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