SUNSOM Automation Equipment Co., Ltd.

LCD repairing,Touch screen repairing,FPC sticking,TAB sticking,LCD assembling, Manufacturer and Supplier - China(CN)

Information for Buyers

SUNSOM Automation Equipment Co., Ltd.
  • Target Markets: The company reliably stes up the "customer first" management concept,pay great attention to the price ,quality,consignment and after-sale service in order to obtain customer trust .You will receive theh best after-sale service ,free technical service and operator training. Warmly welcome customers at home and abroad visit our company for technical exchange and business negotiation.We will do our best to provide you with high quality equipment and satisfactory service.
  • Business Type: Manufacturer
  • Established date: 2006
FOG/COG (Auto Alignment) Bonding Machine XCH71-A8

FOG/COG (Auto Alignment) Bonding Machine XCH71-A8

Business Information

  • Min. Order : 1
  • Made In : China(CN)
  • Packaging : wooden crate
  • FOG/COG (Auto Alignment) Bonding Machine XCH71-A8

Product Features

1. Automatic vision system keeps accuracy of bonding to 5um.
2. Group of feeding COF servo driver that is with the feature of smooth and high-speed that can be applied in FOG and COG.
3. Group of precise moving table adjusting CCD, achieves machine debugging and products replacing in a short time with easy operation.
4. Collector of silicone rubber can avoid friction of cutting head when bonding is not working. However, when bonding is working, silicone rubber can fully touch cutting head.
5. Configure the attached area of LCD independently to ensure firmly attaching of products when the machine is bonding.
6. Platform moving adopted high precise guide rail and sliders that guarantee the accuracy of repeated positioning.
7. Group of tray guarantee the level of LCD.
8. Group of X-Y-Z high precision servo driver satisfies the requirements of automatic bonding.


1. The machine is used for (auto-alignment) pre-bonding and bonding a variety of FPC, COF, TAB to LCD PANEL, also used for Auto pre-bonding and bonding IC to LCD PANEL in COG process.

2. Widely used in FOG assemble bonding, COG assemble bonding of large-size LCD and other fields.



Sensitive paper, Anisotropic conductive film, Silicone rubber, ACF remover, Dust-free Cloth, Ethanol, Cotton swabs



Tweezers, COF Removing Machine, Cutter, Hot air gun

Product Specifications

Basic Parameter:
Input Power: AC220V 50-60Hz
Operating Mode: 7 inches Human Machine Interface
Rated Power: 5 KW
LCD Platform: Servo Memory and Auto-location
Working Pressure: 0.4-0.8mpa
Method of Alignment: Auto-alignment
Size of Pressure Head: (Constant Temperature) Within 70 mm
Thermocouple: K type
Method of Heating: Constant Temperature or Pulse Heating (optional)
Ways of Silicon Rubber Rolling: Rolling Automatically
Controlling Program: PLC + Servo + Auto Vision
Visual System: 2 PCS COLOR CCD
Available Size: Within 85 inches (can be customized)
Dimension: L2200*W1800*H1750mm
Weight of Machine: 400 kg

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