Shenzhen jesen industrial Co.,LTD.

pcb board,pcb,pcb prototype,fr4,Circuit Board, Manufacturer and Supplier - China(CN)

 PCB Board for electronic products

PCB Board for electronic products

Business Information

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Product Features

FPC Production Capabilities ?
Layers 1-8layers (soft & hard combined version is 8 layers)
Finished Board Thickness Min.:10x45mm???Max.:250x1200mm
Available Laminates Material PI.PET,FR4-PI
Finished Board Thickness tolerance ±0.01mm
Finished hole diameter(Min.) 0.1mm
Finished hole diameter(Max) 0.6mm
NPTH Hole diameter tolerance ±0.025mm
PTH hole diameter tolerance ±0.050mm
Copper foil thickness 12um,18um,35um,70um
Circuit width/spacing(Min.) ?0.065mm(1/2oz) ?0.05mm(1/3oz)
Surface Finished type OSP.Gold plating,Immersion Gold,Tin plating(lead free)etc.
Gold Flash Ni/Au thickness Ni:2.54-9um?Au:0.025-0.5um
Immersion Tin thickness 0.7-1.2um
Tin plating thickness 3-15um
Drill hole position tolerance ±0.05mm
Punching dimension tolerance ±0.05mm
Certificate ROHS,UL,ISO9001 etc

 Flexible Printed Circuit

JESEN specializes in the manufacturing and design of flat flexible cable, rigid flex and flexible circuits. We have a wide range of construction material for the manufacturing of our line of flexible circuits to meet customer application requirements. Our flex circuit products include:

§ Flexible Printed

§ Flat Flexible Cable

§ Rigid Flex

FPC and FFC have several advantages in many applications:

· Tightly assembled electronic packages, where electrical connections are required in 3 axes, such as cameras (static application).

· Electrical connections where the assembly is required to flex during its normal use, such as folding cell phones (dynamic application).

· Electrical connections between sub-assemblies to replace wire harnesses, which are heavier and bulkier, such as in cars, rockets and satellites.

· Electrical connections where board thickness or space constraints are driving factors.

· provide the flexible service for OEM & ODM orders

 

FPC Production Capabilities

 

Layers 

1-8layers (soft & hard combined version is 8 layers)

Finished Board Thickness

Min.:10x45mm   Max.:250x1200mm

Available Laminates Material

PI.PET,FR4-PI

Finished Board Thickness tolerance

±0.01mm

Finished hole diameter(Min.)

0.1mm

Finished hole diameter(Max)

0.6mm

NPTH Hole diameter tolerance

±0.025mm

PTH hole diameter tolerance

±0.050mm

Copper foil thickness

12um,18um,35um,70um

Circuit width/spacing(Min.)

≥0.065mm(1/2oz)  ≥0.05mm(1/3oz)

Surface Finished type

OSP.Gold plating,Immersion Gold,Tin plating(lead free)etc.

Gold Flash Ni/Au thickness

Ni:2.54-9um Au:0.025-0.5um

Immersion Tin thickness

0.7-1.2um

Tin plating thickness

3-15um

Drill hole position tolerance

±0.05mm

Punching dimension tolerance

±0.05mm

Certificate

ROHS,UL,ISO9001 etc

 

 

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